The benefits of this method are the ease of packaging technologies, low complexity, and cost-effectiveness. However, the drawbacks include significant parasitic inductance, which leads to signal integrity issues and high energy consumption. Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific Integrated Circuits (ASICs), within the same package. This integration significantly reduces the. For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs. That playbook is no longer holding for today's AI systems. Compared to typical optoelectronic connectivity technology, CPO presents distinct benefits in terms of bandwidth, size, weight, and power consumption.
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