A representative technology of optoelectronic fusion is CPO (co-packaged optical circuit integration). ASIC (application-specific integrated circuit) and GPU and other processors have light engines (laser, modulator, photo detector, etc. ) integrated very close to them (in the same. In 2022, Xiong Yinjiang, together with another young entrepreneur under 30 named Cheng Tangsheng, returned to China to found "OptiFoundry," targeting the then-niche and cutting-edge field of optical chips. Just two years after its establishment, the company successfully taped out what is regarded. 2026 will mark the year when co-packaged optics (CPO), a form of optoelectronic integration, enters the full-scale mass production and practical roll-out phase. Figure 1: Traditional Solution with DSP vs. LPO Solution without DSP Traditional high-speed optical modules rely heavily on Digital. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.
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